PI Plain Base Film

    • Product Name: PI Plain Base Film
    • Chemical Name (IUPAC): Poly(1,4-phenyleneazine-2,5-diyl-1,4-phenyleneazin-2,5-diyl)
    • CAS No.: 26221-27-2
    • Chemical Formula: (C22H10N2O5)n
    • Form/Physical State: Film
    • Factroy Site: Lingwu, Yinchuan, Ningxia, China
    • Price Inquiry: sales2@liwei-chem.com
    • Manufacturer: Anhui Liwei Chemical Co.,Limited
    • CONTACT NOW
    Specifications

    HS Code

    957086

    Productname PI Plain Base Film
    Materialtype Polyimide
    Color Amber
    Thicknessrange 12μm to 125μm
    Density 1.42 g/cm³
    Tensilestrength ≥ 150 MPa
    Elongationatbreak ≥ 50%
    Thermalresistance -269°C to 400°C
    Dielectricstrength ≥ 150 kV/mm
    Waterabsorption ≤ 2.5%
    Surfaceresistance ≥ 1×10¹⁶ Ω

    As an accredited PI Plain Base Film factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The PI Plain Base Film is packaged in a moisture-proof roll, sealed in a box, quantity: 1 roll per box (500 meters).
    Container Loading (20′ FCL) 20′ FCL: Polyimide (PI) Plain Base Film is securely loaded in rolls, moisture-protected, maximizing container space for safe transport.
    Shipping The shipping of PI Plain Base Film requires careful handling to prevent contamination and damage. Rolls are sealed in moisture-proof, anti-static packaging and placed in sturdy cartons. During transit, temperature and humidity are controlled as needed. Material safety and handling documentation accompany each shipment to ensure compliance with regulatory requirements.
    Storage PI Plain Base Film should be stored in a clean, dry, and well-ventilated area away from direct sunlight, heat sources, and moisture. Keep the film in its original packaging or protective wrapping until use to prevent contamination and physical damage. Avoid exposure to extreme temperatures or chemicals, and store flat or hanging to prevent creasing or deformation.
    Shelf Life The shelf life of PI Plain Base Film is typically 12 months when stored in a cool, dry, and dark environment.
    Application of PI Plain Base Film

    High Thermal Stability: PI Plain Base Film with a stability temperature of 400°C is used in flexible printed circuit boards, where it ensures reliable performance under high-temperature soldering processes.

    Dielectric Strength: PI Plain Base Film with a dielectric strength of 200 kV/mm is used in capacitor insulation, where it minimizes electrical breakdown and increases device lifespan.

    Thickness Uniformity: PI Plain Base Film with a uniform thickness of 25 μm is used in display panel substrates, where it provides consistent light transmittance and optimal device clarity.

    Chemical Resistance: PI Plain Base Film featuring excellent chemical resistance is used in semiconductor processing, where it prevents degradation during exposure to aggressive etchants.

    Low Shrinkage: PI Plain Base Film with a thermal shrinkage rate of less than 0.1% is used in photovoltaic cell encapsulation, where it maintains dimensional stability during lamination.

    High Tensile Strength: PI Plain Base Film with a tensile strength of 220 MPa is used in rollable electronic device substrates, where it allows repeated bending without rupture.

    Surface Smoothness: PI Plain Base Film with a surface roughness Ra below 3 nm is used in optical tape manufacturing, where it ensures defect-free adhesive coating and optical clarity.

    Low Water Absorption: PI Plain Base Film with water absorption below 0.5% is used in wearable electronics, where it enhances long-term reliability in humid environments.

    Optical Transparency: PI Plain Base Film with optical transmittance above 85% is used in flexible OLED displays, where it permits high brightness and vivid color rendering.

    High Purity: PI Plain Base Film with purity above 99.9% is used in microelectronic packaging, where it reduces contamination risk and improves device yield rates.

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    Certification & Compliance
    More Introduction

    Exploring PI Plain Base Film: Advancing Durability and Precision in Modern Applications

    Understanding the Foundation of PI Plain Base Film

    In the business of producing advanced polymer films, our team takes pride in materials that hold up under pressure and heat. The PI Plain Base Film is one of those materials that continues to shape industries where thermal stability and dimensional integrity matter most. Designed through controlled polymerization and precise processing, this film provides the robust foundation engineers rely on in electronics, aerospace, automotive, and specialty insulation fields. Over the years, our continuous investment in improved polymer chemistry and state-of-the-art film casting has led us to offer polyimide films with better consistency and higher standards than earlier iterations.

    Model and Specifications: Tailoring Strength to Application

    In our facility, the PI Plain Base Film rolls off the line in multiple grades. These include our Model 605B, widely chosen for its balance of thickness and tensile strength, and Model 705C, preferred when thicker insulation layers or higher elongation are required. Each batch undergoes rigorous testing for thickness uniformity, tensile properties, and dielectric strength. Offering a typical thickness range covering 12μm to 125μm, we focus on providing clarity, pinhole-free surfaces, and color stability throughout the sheet or roll. Material width and sheet length get selected based on customer process needs, whether for slitting, punching, or lamination.

    What sets our PI Plain Base products apart is the consistency we achieve in polymer backbone formation. This yields films with true isotropic strength, resisting not only tear and flex fatigue but also continuous high-temperature exposure up to 260°C. Engineers seeking insulation for circuit boards or battery packs often remark on the dimensional stability after lamination or reflow soldering. Aging tests, including continuous exposure to elevated temperatures and humidity, guide every improvement, making our films a proven solution in environments that would degrade lower-grade polymers.

    Applications: Meeting Industry Demands

    Customers use our PI Plain Base Film in various demanding sectors. Most often, you’ll find these films as substrates in flexible printed circuits and in high-stress insulation for transformer windings. Battery manufacturers incorporate it as inner and outer wraps on lithium-ion cells because it endures temperature swings without significant size changes or breakdown. In the aerospace industry, technicians count on its inertness to solvents and fuel, especially where weight and reliability can't be compromised. We've worked with automotive engineers tuning hybrid and electric vehicle motors, where the film separates and shields coils without delamination, even after years of thermal cycling.

    Tape converters rely on our film's smooth, defect-free surface for precision coating with adhesives or conductive chemistries. This ensures their tapes retain flexibility and adhere well under varying pressures and conditions. Laser and die cutting lines operate more efficiently because our material presents less curl and consistent thickness—critical for intricate electronic components. The photographic and display sector appreciates the optical clarity and color retention, especially where yellowing and haze can ruin high-end products.

    Practical Advantages: What Makes Our Film Different

    From the producer’s perspective, the difference starts with monomer purity and controlled reaction environments. By maintaining low levels of ionic contamination and residual solvents, we enhance the polymer’s electrical properties. Customers notice longer service life, fewer failures from tracking or arc-over, and less need for frequent replacement. The surface chemistry helps resists fogging and does not support fungal growth. We keep a close eye on moisture uptake and dimensional swell, so manufacturers working in humid climates trust our film not to warp equipment tolerances or create leaks in sensitive assemblies.

    As the processes behind electronics and battery technology evolve, we work with R&D teams to deliver films with specific surface energies and controlled roughness—helpful in advanced coating adhesion or fine-line copper circuit printing. Consistency batch to batch means less rework for assembly lines, leading to cost reductions and fewer rejected lots. Traditional films made from polyester or aromatic polyamides lack the high heat tolerance and flexibility these applications demand, leading to embrittlement or failure after short service cycles.

    Supporting Evidence: Real Manufacturing Challenges Solved

    One electronic components manufacturer faced repeated failures using a common PET film as cabling insulation for a high-performance server farm. With temperature spikes reaching 130°C, PET exhibited shrinkage and began to split near solder joints. Switching to our polyimide base film not only eliminated the splitting, but prolonged cable operating life by over 60 percent, cutting costly downtime and reducing maintenance budgets. Field technicians no longer report yellowing or embrittlement, as the polyimide backbone resists both UV and thermo-oxidative aging. In another case, a lithium battery supplier struggled with cell pack swelling and separator ruptures. Our product’s low outgassing, high puncture resistance, and chemical inertness delivered a clear improvement, with users seeing fewer recalls and safety incidents stemming from insulation failure.

    In the specialty composite field, our film enabled an aerospace supplier to switch from thicker, less flexible Aramid papers to thin-gauge polyimide layers, cutting total insulation mass by 15 percent. This allowed more capacity for payload, extending flight range and improving equipment lifespan. Our engineering team supports OEMs with rapid prototyping rolls, technical data, and in-person support to solve unique lamination or bonding issues. We approach each request with practical factory-floor experience, enabling faster process integration and fewer false starts.

    Material Performance: In the Lab and at Scale

    Reliability depends on repeatable results. Each batch runs through multi-stage quality controls, from gel count analysis to dielectric breakdown testing at voltages above typical industrial use. Tensile strength averages remain above 140 MPa for most film grades, while elongation at break frequently exceeds 60 percent. Because of our closed-environment manufacturing, migration of ions or molecular fragments sits far below those seen in open-batch systems. Years of export to partners operating under tough international standards—UL, IEC, RoHS—have refined our traceability and documentation systems to ensure confidence across the supply chain.

    Processing feedback from our clients repeatedly points out the ease with which our film unwinds and feeds into press or laminator, creating less waste and maintaining precise edge cleanliness. Even thin grades, often a struggle to slit and handle, hold true on the roll and feed evenly, speeding throughput for large-scale power transformer and high-end electronics fabricators. The consistent surfacing also means less scrap during adhesive, printing, or metallization steps.

    Looking Ahead: Refining Technology for Tomorrow

    As energy storage, digital infrastructure, and electric vehicle sectors grow, so does the demand for base films with higher temperature stability and better mechanical resilience. We remain attentive to feedback from OEMs, lab scientists, and machinists, feeding observations back into both resin formulation and process line upgrades. This encompasses everything from tighter molecule weight control in synthesis to improved environmental cleanliness in casting and annealing bays.

    To push the performance even further, work has started on hybridizing base films with nanofillers that improve fire retardancy without sacrificing clarity or thickness. Early tests show promise in enabling even thinner insulation barriers, especially for next-generation battery cells, without the risk of shorting or breakdown in overload conditions. We have also advanced self-cleaning surface treatments, limiting dust accumulation and improving light transmission for display and optics clients. These incremental advances emerge from a decade of daily improvements on the plant floor, where even the small process tweaks can bring huge reliability gains at scale.

    Comparing to Alternative Materials: Real-World Observations

    Polyester films, once the mainstay of insulation, cannot handle long-term exposure to above 120°C, and succumb quickly to hydrolytic breakdown in humid conditions. Polyimide base films, by contrast, offer long life in heat, without the embrittlement or chalking seen in less robust polymers. In electronic circuits requiring fine flexing, only polyimide maintains flexibility after thousands of bends, while many alternatives kink and crack, leading to circuit breakage. Polyamide films, though somewhat heat-resistant, fall short on electrical properties and chemical resistance, especially in the aggressive environments of automotive powertrains or industrial drives.

    The cost difference between base polyimide film and legacy PET or Aramid insulation narrows once lifecycle costs are considered. Product recalls, waste from failed batches, and unplanned equipment downtime make the choice for reliability obvious for many high-spec customers. Even at launch, these films offer a return on investment when weighed against the higher cost of frequent replacements and maintenance downtime. As polymers age in the field, the details become even clearer—no spontaneous loss of flexibility, consistent color, and no outgrowth of corrosive byproducts into metallic contacts.

    Customer Collaboration: Engineering Success Stories

    Our best results come from close customer collaboration. In advanced power electronics, for example, engineers wanted insulation that maintained structure at 200°C and did not degrade with cycling power loads. Over months of joint testing, process modification, and shared optimization, we supplied a film that met their new, aggressive parameters. Now, their assemblies withstand harsher operating cycles without insulation breakdown. Battery system integrators working to increase discharge rates while compressing size find our film’s thinness and mechanical properties enable tighter pack designs with minimal risk of puncturing, arcing, or catastrophic swelling under load.

    Display manufacturers handling optical sensors or organic LEDs encounter issues with competitive polyimide films that yellow after repeated UV exposure. Our team engineered additives and improved drying protocols to reduce chromatic shift, resulting in better consistency for their high-demand end users. Electronics assembly companies running automated roll-to-sheet and roll-to-roll systems face bottlenecks due to curl or misalignment with lesser films, while ours lays flat, resists static buildup, and makes the lamination and soldering sequence more predictable. We don't just ship, we support integration, draw on data from our own operations, and invest in relationships that strengthen the next batch.

    Commitment to Quality and Responsibility

    Our production facility has moved beyond just churning out plastic. Compliance means more than ticking a box, so tracking each lot and batch at each point—from incoming monomers to finished rolls—supports verifiable supply chain documentation. Safe handling protocols for operators, detailed waste minimization plans, emission controls, and end-user education campaigns are all part of standard operating rhythm. We treat EHS goals with the same seriousness as production targets, and customer audits regularly examine our transparency and sustainability claims. Lab teams continually review new formulation chemistries, looking to limit hazardous constituents and reduce residual solvents. Such attention benefits performance and boosts trust from partners who build products with decades-long expected lifespans.

    By managing technical staff training and encouraging honest feedback, we keep a culture where problems get solved fast, not hidden. Practical improvements often begin with a conversation on the shop floor or a call from a process engineer dealing with a new substrate or temperature target. We document these cases and convert lessons learned into longer-term changes. That feedback loop, along with required certifications and independent laboratory testing, means project risks are identified and solved before they affect end products or customers’ operations.

    Staying Ahead through Innovation and Responsiveness

    The world asks more of advanced films each year. Higher speeds in electronics, tougher mechanical stress, and growth in renewable energy all put unique pressure on the next generation of insulation and base substrates. Flexible manufacturing allows us to refine specifications, composition, and finishing processes without long lead times. By prioritizing material longevity, defect-free appearance, and enhanced process compatibility, we help manufacturers ramp up production, lower their waste rates, and offer products with fewer returns due to performance failures.

    Communication with the engineering and technical staff of key accounts keeps us aligned with each new requirement, whether related to environmental tolerance, flame retardancy, or evolving standards tied to recyclability or recovery. By monitoring our own line scrap, emissions, and water use, we reduce the ecological footprint, a step increasingly required by buyers in sectors from automotive to consumer electronics.

    Guidance for Industry and Partners

    PI Plain Base Film has moved past the generic reputation of “plastic sheet.” For critical insulation, buffering, or high-frequency assembly, this material becomes part of system longevity and reliability, providing a backbone upon which high-end gear and infrastructure rest. Field failures, once frequent with older insulation materials, now occur far less frequently, benefitting not only manufacturers but also the end users and service staff supporting those products in the wild. The professionalism of our teams—not only in manufacturing but also in technical service, R&D, and logistics—continues to make the difference between commercial risk and commercial success.

    Every day, global manufacturers balance the cost of inputs against the need for robust, long-life performance in high-value applications. Our experience with PI Plain Base Film shows that reliability and performance do not come from chance. Instead, they emerge from disciplined process control, customer feedback, and careful, knowledgeable stewardship at every stage of production and product rollout. For those navigating complex and fast-changing industries, such partnerships and material choices often transform not just products, but also the way companies build, scale, and lead in their markets.